Bergquist HI-FLOW THF 1600P

Henkel-Bergquist HI-FLOW THF 1600P is the electrically insulating and thermally conductive pad that ensures excellent thermal and electrical insulating performance.
HI-FLOW THF 1600P, polyimide reinforced adhesive, is the thermal interface material ideal for electronic power devices that require electrical isolation to the heat sink.
Maximum reliability without thermal degradation or loss of properties even at high operating temperatures.
The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies.

FEATURES:
– Appearance: Green
– Reinforcement carrier: Polyimide
– Total thickness: 0.102 to 0.127mm
– Film thickness: 0.025 to 0.05mm
– Operating temperature: 150°C
– Thermal impedance: 0.13°C in2/W @ 25 psi

APPLICATION:
Industrial automation, transport, green energy, automotive