The thermal interface materials are essential to guarantee the thermal conductivity of devices, ensuring an efficient heat transfer.
Especially with the increasing miniaturization of electronic device packaging and the creation of components able of working at increasingly higher frequencies, electronic devices require appropriate thermal management systems.
Among the thermal management solutions distributed by Welt Electronic, there are gap filler, gap pad, EMI/EMC tapes, heat sinks, both standard and custom, to satisfy every single request.
Learn more about all the solutions distributed by Welt Electronic
To request information on products, or for any other request, fill out the form and you will be contacted as soon as possible
HEADQUARTER
Via della Treccia, 33 – 50145 Firenze
(Italy) +39 055 302631
info@weltelectronic.it
weltelectronic@pec.it
gdpr@weltelectronic.it
P.IVA: 03714360488
PRODUCTION
Via della Treccia, 8 – 50145 Firenze
(Italy) +39 055 302631
BRANCH OFFICE
Via Cristoforo Colombo, 5/c – 20094 Corsico, Milano – Tel. +39 02 4585637
LOCAL OFFICES
Padova – Roma – Torino – Genova – Bologna – Ancona
Credits: b2commerce
To request information on products, or for any other request, fill out the form and you will be contacted as soon as possible